Techspray Silicone-Free Heat Sink Compound: 4 oz Size
#917386-2 | Pkg Qty: 1
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Technical Specifications
Key Specifications
General
Product Description
With the ability to draw heat away when applied to a component, this TECHSPRAY silicone-free heat sink compound is generally used to thermally bond a component with a mechanical heat sink. Suitable for use in a variety of electrical applications including use with calrods, thermistors, and thermocouple wells. This easy-to-apply material is non-ozone depleting and it won’t separate, harden, or crack.
- Thermal conductivity: 0.92 W/m-K
- Functional temp. range: -40° to 392°F
Expertly Selected Product Pairings
Compliance & Restrictions
| Name | Item | Description | |
|---|---|---|---|
 | Grainger Dropship | 19YY66 | Silicone- Free Heat |
 | UNSPSC CODES | 32131001 | |
 | VMRS (ATA) CODES | 053-999-058 | Silicone- Free Heat |
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